美国对华301四年期审最终结果 Notice of Final Modifications - September 18, 2024
https://www.guanwuxiaoer.com/data/attachment/forum/201909/23/102148jc5gclell5lelull.pngNotice of Final Modifications - 89 FR 76581 (September 18, 2024)
https://ustr.gov/sites/default/files/89%20FR%2076581%20(September%2018%2C%202024).pdf
【实施日期】
2024年的关税上调适用于2024年9月27日或之后入仓消费或出仓消费的产品。2025年和2026年的关税上调适用于在相应年份的1月1日或之后入仓消费或出仓消费的产品。附件B中太阳能设备的除外情况具有追溯性，适用于2024年1月1日或之后至5月31日期间入仓消费或出仓消费的产品。
【Annex A 附件A】
包含14种产品关税上调的非正式表格总统指定的组别、382个小标题和7个统计报告编号、关税税率和关税上调年份。
【Annex B 附件B】
包含太阳能制造设备的14项临时排除。
排除生效日期：2024-9-27日起
排除加征有效期限：2024-1-1至2025-5-31（关务小二提醒：2024年1月1日至2024年9月27日之间被加征关税的下列产品，可追溯申请PSC操作退回所加征的301关税）
Silicon growth furnaces, including Czochralski crystal growth furnaces, designed for growing monocrystalline silicon ingots (boules) of a mass exceeding 700 kg, for use in solar wafer manufacturing (described in statistical reporting number 8486.10.0000)
Band saws designed for cutting or slicing cylindrical monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into square or rectangular ingots (boules), for use in solar wafer manufacturing (described in statistical reporting number 8486.10.0000)
Machines designed to align and adhere square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 200 kg to plastic support boards on metal mounting plates to provide support during diamond wire sawing, for use in solar wafer manufacturing (described in statistical reporting number 8486.10.0000)
Diamond wire saws designed for cutting or slicing square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into solar wafers of a thickness not exceeding 200 micrometers (described in statistical reporting number 8486.10.0000)
Wire guide roller machines, presented with diamond wire saws designed for slicing square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into solar wafers of a thickness not exceeding 200 micrometers, all of the foregoing for use in solar wafer manufacturing (described in statistical reporting number 8486.10.0000)
Coolant fluid recycling machines, presented with diamond wire saws designed for slicing square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into solar wafers of a thickness not exceeding 200 micrometers, all of the foregoing for use in solar wafer manufacturing (described in statistical reporting number 8486.10.0000)
Degumming machines designed to remove adhesives from solar wafers (described in statistical reporting number 8486.10.0000)
Texturing, etching, polishing, and cleaning machines designed to prepare, repair, clean, etch, polish or texture the solar wafer substrate, whether or not integrated with automation equipment for transferring solar wafers from one process station to the next, all the foregoing for use in solar wafer manufacturing (described in statistical reporting number 8486.20.0000)
Thermal diffusion quartz-tube furnaces, designed to diffuse dopant impurities into square or rectangular silicon wafers, whether or not integrated with automation equipment for transferring solar wafers from one process station to the next or boat loading or unloading machines, all the foregoing for use in solar cell manufacturing (described in statistical reporting number 8486.20.0000)
Plasma-enhanced or low-pressure chemical vapor deposition machines designed to deposit amorphous or nanocrystalline layers on one or both surfaces of a solar wafer, whether or not integrated with automation equipment for transferring solar wafers from one process station to the next, all the foregoing for use in solar cell manufacturing (described in statistical reporting number 8486.20.0000)
Physical vapor deposition (PVD) machines, designed to deposit a thin film of transparent conducting oxide on one or both surfaces of a solar wafer, whether or not integrated with automation equipment for transferring solar wafers from one process station to the next, all the foregoing for use in solar cell manufacturing (described in statistical reporting number 8486.20.0000)
Screen printing line machines, including sintering furnaces for printing conducting contacts on both surfaces of a solar wafer, whether or not integrated with automation equipment for transferring solar wafers from one process station to the next, and whether or not integrated with equipment for solar cell testing, all the foregoing for use in solar cell manufacturing (described in statistical reporting number 8486.20.0000)
Machines designed for transporting polysilicon material to growth furnaces and machines designed for transporting monocrystalline ingots (boules) and wafers throughout the solar wafer manufacturing process, including machines for loading or unloading solar wafers during the diamond wire slicing process (described in statistical reporting number 8486.40.0030)
Machines designed for lifting, handling, loading, or unloading of solar wafers of a thickness not exceeding 200 micrometers, for use in solar wafer manufacturing (described in statistical reporting number 8486.40.0030)
【Annex C 附件C】
包含《美国统一关税表》的修改，以征收额外关税，提高额外关税税率，并将某些太阳能制造设备排除在额外关税之外。
【Annex D 附件D】
包含根据排除条款进入的船岸起重机的进口商认证。
【Annex E 附件E】
列出了根据机械排除程序有资格考虑临时排除的《美国统一关税表》子目。
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